Advanced Packaging Multi-Physics Modeling Engineer

Openai·Remote(San Francisco)

Software Development

WFA Digital Insight

As the demand for AI-native silicon continues to grow, companies like Openai are looking for experts to lead multi-physics modeling and simulation. With the advancement of digital skills and remote work, this role offers a unique opportunity for engineers to work on cutting-edge technology. The global semiconductor market is expected to reach $522 billion by 2027, with AI applications driving the demand for specialized hardware. To succeed in this role, candidates need to have a strong foundation in thermal and mechanical modeling, as well as experience with finite element analysis and multi-physics simulation tools. Before applying, candidates should be aware of the company's focus on innovation and collaboration, and be prepared to drive co-optimization of chip, package, and system interactions.

Job Description

About the Role

The Advanced Packaging Multi-Physics Modeling Engineer will play a crucial role in Openai's Hardware organization, which develops silicon and system-level solutions designed for the unique demands of advanced AI workloads. The team is responsible for building the next generation of AI-native silicon while working closely with software and research partners to co-design hardware tightly integrated with AI models. As a key member of the team, the successful candidate will lead multi-physics modeling and simulation for next-generation advanced packaging systems, driving co-optimization of thermal, mechanical, and electrical interactions across chip, package, and system levels. The role requires a deep understanding of the complex interactions between thermal, mechanical, and electrical systems, as well as the ability to develop and validate electro-thermal-mechanical simulation methodologies for heterogeneous integration platforms. The candidate will collaborate closely with cross-functional engineering teams and external partners to predict and optimize package mechanical, electrical, and thermal performance, and system scalability for advanced heterogeneous integration platforms. The team at Openai is passionate about pushing the limits of heterogeneous integration, high-power delivery, advanced cooling, and large-scale packaging architectures. As a member of this team, the successful candidate will have the opportunity to influence real product architecture decisions through simulation-driven insights across chip, package, cooling, and system design.

What You Will Do

Lead multi-physics modeling and simulation across thermal, mechanical, and electrical domains for next-generation AI/HPC advanced packaging systems
Drive co-optimization of chip, package, and system interactions to improve power integrity, thermal performance, mechanical reliability, and overall package scalability
Develop and validate electro-thermal-mechanical simulation methodologies for heterogeneous integration platforms including 2.5D/3D packaging, HBM integration, and chiplet architectures
Perform reliability assessment and root-cause analysis for package warpage, stress, underfill interaction, solder fatigue, electromigration, and thermo-mechanical failures
Correlate simulation results with silicon, hardware measurements, and reliability test data to improve modeling accuracy and design predictability
Collaborate with cross-functional engineering teams to integrate modeling and simulation results into the design process
Work with external partners to develop and implement new simulation methodologies and tools
Participate in the development of technical roadmaps and project plans
Communicate complex technical information to both technical and non-technical stakeholders
Stay up-to-date with industry trends and developments in multi-physics modeling and simulation

What We Are Looking For

Strong experience in thermal and mechanical modeling for advanced packaging systems
Solid understanding of electro-thermal interactions and temperature-dependent electrical behavior
Experience solving complex chip/package/system integration challenges using multi-physics simulation and first-principles engineering approaches
Hands-on experience with finite element analysis (FEA) and multi-physics simulation tools such as ANSYS, COMSOL, Abaqus, Icepak, or equivalent
Knowledge of package reliability mechanisms including warpage, solder fatigue, underfill stress, electromigration (EM), and thermo-mechanical interactions
Experience with scripting languages such as Python or MATLAB
Strong communication and collaboration skills
Ability to work in a fast-paced environment and prioritize multiple tasks and projects
Experience with project management tools and version control systems

Nice to Have

Strong understanding of electro-thermal interactions and temperature-dependent electrical behavior in high-performance computing applications
Familiarity with advanced packaging design including CoWoS, EMIB, chiplets, HBM integration, and 3D stacking
Familiarity with advanced packaging technologies, design flows, materials, and manufacturing processes including CoWoS, EMIB, chiplets, HBM integration, and 3D stacking
Experience with machine learning or artificial intelligence applications
Familiarity with cloud-based simulation tools and platforms

Benefits and Perks

Competitive salary and benefits package
Opportunity to work on cutting-edge technology and contribute to the development of AI-native silicon
Collaborative and dynamic work environment
Flexible working hours and remote work options
Access to cutting-edge tools and technologies
Professional development opportunities and training programs
Recognition and rewards for outstanding performance and contributions
Comprehensive health insurance and wellness programs
Generous paid time off and vacation policy
Access to exclusive company events and networking opportunities
Opportunity to work with a talented and diverse team of engineers and researchers
Flexible and supportive work environment that encourages work-life balance
Recognition as a leader in the field of AI and machine learning

How to Stand Out

To stand out in this role, make sure to highlight your experience with multi-physics modeling and simulation, as well as your knowledge of electro-thermal interactions and temperature-dependent electrical behavior.
When preparing for the interview, review the company's website and research their current projects and initiatives to demonstrate your interest and enthusiasm.
Be prepared to provide specific examples of your experience with finite element analysis and multi-physics simulation tools, as well as your ability to communicate complex technical information to both technical and non-technical stakeholders.
Consider creating a portfolio or repository of your work to showcase your skills and experience, and be prepared to walk the interviewer through your design decisions and simulation results.
During salary negotiations, be sure to research the market rate for the position and be prepared to make a strong case for your desired salary based on your experience and qualifications.
Pay attention to the company culture and values, and be prepared to ask questions about the team's dynamics and expectations.
Be honest and transparent about your strengths and weaknesses, and be prepared to discuss your career goals and aspirations

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